Industry News
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Squaring the Circle: How Glass Became the Substrate AI Packaging Needed
For thirty years advanced packaging rested on a round silicon wafer and an organic resin called ABF. Both are hitting their limits at once, and the industrys answer is a material older than chipmaking itself: glass. 2026 is when it stopped being a sli…
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AI Demand Reshapes the Electronics Components Market
TSMC sets the toneTSMCs third-quarter results, released October 15, came in above its own guidance: revenue of US$46.72 billion (up 50.9% year on year), net income of NT$763.06 billion (up 68.7%), and a sixth consecutive record quarter. Advanced nodes…
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Schottky Diode Principle, Selection Criteria and High-speed Rectifier Circuit Design
Technical BackgroundSchottky diode is a high-efficiency, high-speed semiconductor rectifying device widely used in switching power supplies, DC-DC converters, reverse polarity protection circuits and freewheeling loops. Different from ordinary PN junc…
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Boost DC-DC Converter Principle, Parameter Selection and Step-up Power Design
Technical BackgroundBoost DC-DC converter is a classic step-up switching power topology widely adopted in battery-powered systems, LED drivers, sensor modules and portable electronic devices. Different from Buck step-down circuits, Boost topology rais…
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MOSFET Principle, Parameter Selection and Switching Circuit Design
Technical BackgroundMOSFET (Metal Oxide Semiconductor Field Effect Transistor) is the core switching device in switching power supplies, DC-DC converters, motor drivers and load switch circuits. Compared with triode transistors, MOSFET features high i…
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