High‑Voltage Power Semiconductor Chips

Product Overview

High‑voltage power semiconductor chips are the core power‑switching hardware of new‑energy power‑conversion systems, covering IGBT, SiC MOSFET, fast‑recovery diodes and gate drive integrated circuits. Designed and manufactured according to new‑energy power‑device certification standards, the chips adopt high‑voltage‑resistant packaging and low‑switching‑loss architecture to adapt to frequent heavy‑load switching‑on‑and‑off. Excellent heat‑dissipation performance and strong surge‑current tolerance support mass‑production deployment for photovoltaic inverters, energy‑storage converters and DC‑fast‑charging piles.

Core Electrical Characteristics

The applicable operating‑temperature interval ranges from ‑40℃ to 150℃, adapting to outdoor high‑temperature cabinet‑body operation and low‑temperature startup. Built‑in over‑current locking‑up and temperature‑feedback modules prevent device breakdown under surge‑current impact. Optimized electromagnetic‑compatibility performance suppresses high‑frequency switching noise generated by power conversion. Low switching loss cuts thermal output under high‑speed operation and improves the overall energy‑conversion rate of power equipment.

Key Product Advantages

1. New‑Energy Equipment Standard Compliance: Full‑series products satisfy high‑voltage‑safety inspection criteria and adapt to batch assembly of grid‑connected new‑energy facilities.

2. Superior High‑Temperature Load Adaptability: Optimized chip‑structure design sustains stable switching‑performance under long‑time heavy‑load working‑conditions.

3. Graded Voltage‑and‑Current Specifications: Multiple voltage‑current grades fit small‑sized household photovoltaic inverters and large‑scale grid‑side energy‑storage converters.

4. Highly‑integrated Drive‑protection Structure: Integrated driving, temperature‑detection and fault‑feedback circuits simplify PCB layout and reduce peripheral‑part costs.

Applicable Industries and Scenarios

The chips are applied to solar‑power inverters, wind‑power converters, lithium‑ion‑battery energy‑storage systems, automobile fast‑charging stations and portable power‑supply equipment. Primary usage scenarios include DC‑AC power inversion, charging‑discharging power adjustment and high‑voltage‑loop switch control. Target clients are new‑energy‑equipment manufacturers, energy‑station system integrators and distributed power‑station solution developers.

Model‑Selection Instructions

Chip selection takes system rated‑voltage, continuous load‑current, switching‑frequency demands, ambient‑temperature conditions and heat‑dissipation schemes into comprehensive consideration. High‑efficiency high‑frequency converters adopt silicon‑carbide power chips. Low‑frequency large‑capacity energy‑storage inverters select IGBT components. Compact portable power supplies choose small‑packaged power semiconductors.

Operation Precautions

Soldering and assembly follow high‑power‑device mounting standards and strictly control welding temperature and duration to avoid damaging the internal semiconductor lattice. High‑heat‑emitting power chips shall be fitted with matched heat sinks and reserved sufficient air‑flow space. Official drive parameters shall be configured and unauthorized modification of gate‑drive resistance is prohibited. Anti‑static, shock‑proof and damp‑proof protection shall be implemented throughout component storage and transportation.