Onboard Sensors and Power Devices
Product Overview
Onboard sensors and power‑semiconductor devices are foundational hardware for signal acquisition and power output. Product portfolios include radar detectors, attitude sensors, temperature‑pressure transducers, automotive‑grade MOSFETs, IGBT and SiC power components. These devices accomplish environmental perception, real‑time status monitoring, electric‑energy conversion and motor drive. Manufactured under strict automotive‑grade quality‑management criteria, they deliver high measuring precision, excellent energy‑conversion efficiency, great voltage endurance and prolonged service life for perception modules and new‑energy power‑train assemblies.
Key Performance Specifications
The measuring error of onboard sensors stays below 0.5% with microsecond‑scale response speed for real‑time acquisition of vehicle posture, road‑environment data, engine‑compartment temperature and pipeline pressure. The operating‑temperature range reaches ‑40℃~150℃. Anti‑vibration capability and IP67‑grade waterproof‑dustproof standards adapt components to severe chassis and engine‑compartment installation surroundings. Voltage ratings of power semiconductors span 60V‑1200V for low‑voltage hybrid and high‑voltage pure‑electric platforms. Peak energy‑transfer efficiency hits 98% with minor switching loss and effective heat dissipation for high‑voltage new‑energy automobile power systems.
Key Product Advantages
1. Harsh‑Environment Adaptability: Optimized hardware structures counteract vibration, high‑voltage interference and humid surroundings to serve the full service‑life cycle of automobiles.
2. Superior Working Performance: Fast‑response sensors capture accurate data, and low‑loss power semiconductors raise motor efficiency and cut vehicle‑mounted energy consumption.
3. Comprehensive Safety‑Protection Mechanism: Over‑voltage, over‑current, over‑heat and short‑circuit protection rapidly triggers circuit disconnection during unexpected operating‑condition changes and safeguard driving security.
4. Standardized Compatibility: Unified outer dimensions, electrical parameters and interfaces match mainstream automobile‑electronic frameworks and accelerate solution iteration and batch production.
Applicable Fields
The hardware adapts to pure‑electric, hybrid, fuel‑fired and intelligent‑networked automobiles. Primary deployment scenarios cover autonomous‑driving environmental‑sensing assemblies, vehicle‑state monitoring hardware, battery‑management equipment, motor drivers, onboard power‑supply converters and chassis‑control modules. Additional use cases include vehicle modification, special‑vehicle electronic‑system upgrading and auxiliary onboard‑device matching.
Device‑Selection Guide
Sensor selection refers to mounting locations, measuring ranges, precision demands, protection ranks and temperature tolerance. High‑protection‑grade sensors are deployed on exposed chassis and engine‑compartment positions. Power‑device choices are determined by system voltage platforms, motor power, switching‑frequency requirements and thermal‑dissipation assemblies. SiC and IGBT semiconductors serve high‑voltage new‑energy cars, and regular automotive‑grade MOSFETs fit low‑voltage auxiliary circuits.
Installation and Maintenance Notes
Sensors are firmly fixed away from high‑frequency vibration points with calibrated detection angles and post‑installation working‑condition debugging. Power semiconductors are assembled with matched heat‑sink modules for thermal dissipation and heat‑accumulation prevention. Wiring construction complies with automotive‑grade electrical specifications for the elimination of poor‑contact faults. Periodic circuit inspection identifies component aging and performance attenuation and sustains stable operation of whole‑vehicle electronic‑control assemblies.